Save Job Back to Search Job Description Summary Similar JobsWork with cutting-edge semiconductor packaging technologiesDrive meaningful impact across global manufacturing operationsAbout Our ClientOur client is a globally recognised technology manufacturing organisation supporting some of the world's leading electronics and semiconductor companies. With significant investments in advanced packaging technologies and innovation, the company offers engineers the opportunity to work on complex products within a highly collaborative and fast-paced environment.Job DescriptionLead failure analysis investigations on customer returns, production rejects, and reliability test failures to identify root causes and drive effective corrective actions.Perform failure analysis and reliability assessments for advanced semiconductor packaging technologies, including Flip Chip, WLCSP, Fan-Out, SiP, and BGA products.Utilise advanced analytical techniques and tools such as SEM, FIB, CSAM, X-Ray, cross-sectioning, and reliability testing to determine failure mechanisms.Drive structured problem-solving activities using methodologies such as 8D, FMEA, DMAIC, Six Sigma, and CAPA.Collaborate with Product, Process, Manufacturing, Quality, and Reliability teams to resolve technical issues, improve yield, and enhance product performance.Analyse failure and reliability data to identify trends, support continuous improvement initiatives, and strengthen manufacturing quality.Prepare and present technical reports, findings, and recommendations to internal stakeholders and customers.The Successful ApplicantBachelor's Degree or higher in Electrical Engineering, Electronics Engineering, Materials Science, Mechanical Engineering, or a related discipline.Minimum 5-10+ years of experience in Failure Analysis, Reliability Engineering, Advanced Packaging, Semiconductor Manufacturing, or related environments.Strong understanding of semiconductor failure mechanisms, assembly processes, and material interactions.Hands-on experience operating advanced FA equipment and analytical tools.Proven ability to lead complex technical investigations and drive sustainable corrective actions.Strong analytical, communication, and stakeholder management skills.Experience within semiconductor manufacturing, OSAT, foundry, or advanced packaging environments will be highly advantageous.What's on OfferCompetitive remuneration package and performance incentives.Exposure to advanced semiconductor technologies and global customer programs.Career development opportunities within a growing high-technology organisation.Collaborative and innovation-driven engineering culture.Opportunities to work on challenging, high-impact projects that directly influence product quality and customer satisfaction.ContactIsabelle De CostaQuote job refJN-102026-7137328Phone number+603 2302 4075Job summaryFunctionEngineering & ManufacturingSpecialisationQuality, TechnicalWhat is your area of specialisation?Industrial / ManufacturingLocationBayan LepasContract TypePermanentConsultant nameIsabelle De CostaConsultant contact+603 2302 4075Job ReferenceJN-102026-7137328