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The Continuous Improvement Engineer Manager will lead and oversee process improvement initiatives within the industrial/manufacturing sector in Penang. This role focuses on driving effective operations and fostering efficiency through innovative engineering solutions.
The Process Engineer (Project) is responsible for optimising and developing manufacturing processes to improve efficiency, quality, and production performance, especially during launch phases. The position requires strong technical expertise, hands-on problem solving, and cross-functional coordination to implement improvements and ensure smooth operational execution.
The Senior Process Engineer leads the evaluation, development, and commercialization of innovative technologies that transform renewable and recycled feedstocks into specialty oils. The role oversees full‑lifecycle engineering projects-from R&D and feasibility studies to industrial commissioning and global partnership development.
Lead customer quality and continuous improvement initiatives for key accounts in a global semiconductor manufacturing environment. This role combines customer-facing quality leadership, problem-solving, and team management responsibilities.
The Quality Manager Team Lead (Product Quality) is responsible for leading a team of Product Quality Engineers and ensuring excellent product quality performance across assigned product families. The role focuses on NPI quality readiness, defect prevention, root cause analysis, customer quality support, and the development of a highly capable quality engineering team.
The Senior Supplier Quality Engineer (NPI) will lead supplier quality execution and readiness for new product introduction programmes, ensuring supplier risks are proactively managed and quality standards are met throughout the development cycle. The role partners closely with Engineering, Operations, Procurement and Quality teams to deliver predictable, high-quality product launches and achieve business quality objectives.
The Failure Analysis Section Manager leads the failure analysis function for semiconductor backend and advanced packaging operations, ensuring rapid root cause identification and resolution of complex technical issues. This role combines technical expertise, team leadership, and customer-facing responsibilities to drive yield improvement, reliability, and continuous operational excellence.
This role leads technical solution delivery for Ball Bonder (BB) and Wedge Bonder (WB) customers, supporting both pre-sales and post-sales activities. It combines customer engagement, technical expertise, and cross-functional collaboration to drive successful adoption and optimisation of semiconductor bonding solutions.
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