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Failure Analysis Section Manager

Bayan Lepas Permanent MYR96,000 - MYR180,000 per year View Job Description
The Failure Analysis Section Manager leads the failure analysis function for semiconductor backend and advanced packaging operations, ensuring rapid root cause identification and resolution of complex technical issues. This role combines technical expertise, team leadership, and customer-facing responsibilities to drive yield improvement, reliability, and continuous operational excellence.
  • Strong Platform for Accelerated Career Growth
  • Holistic Skill Development

About Our Client

Our client is a leading global semiconductor player specialising in advanced packaging and high-volume manufacturing. They partner with top-tier global customers and are known for their strong engineering capabilities, innovation in packaging technologies, and commitment to quality and reliability.

Job Description

  • Lead, mentor, and develop the Failure Analysis (FA) team, driving capability building, performance management, and a culture of technical excellence
  • Oversee end-to-end FA operations across customer returns (RMA), electrical test failures, assembly defects, and reliability issues, ensuring high-quality output and fast turnaround time
  • Lead complex failure investigations in advanced packaging technologies (e.g. Flip Chip, WLCSP, Fan-Out, SiP, BGA), identifying key failure mechanisms and risks
  • Guide the team on advanced FA methodologies and tools (SEM, FIB, CSAM, X-ray, etc.), ensuring robust and accurate analysis
  • Drive structured root cause analysis (8D, DMAIC, FMEA) and ensure effective implementation of corrective and preventive actions (CAPA)
  • Collaborate cross-functionally with Process, Product, Manufacturing, Test, and Quality teams to resolve issues, support NPI, and improve overall yield
  • Serve as the technical lead for customer escalations, presenting FA findings, root cause analysis, and action plans clearly and professionally
  • Analyse FA data and trends to drive continuous improvement in yield, defect reduction, and reliability, while enhancing FA lab capabilities and operational efficiency



The Successful Applicant

  • Degree in Electrical, Electronics, Materials, Mechanical Engineering or related field
  • 8-15+ years in semiconductor FA / advanced packaging / backend manufacturing
  • Strong expertise in failure physics, materials, and assembly processes
  • Hands-on with FA tools (SEM, FIB, TDR, CSAM, X-Ray, etc.)
  • Proven experience managing technical teams and complex customer escalations
  • Strong leadership, analytical thinking, and stakeholder management skills
  • Exposure to OSAT/foundry environments and global customers is highly advantageous



What's on Offer

  • Opportunity to lead a critical function in a globally competitive semiconductor organisation
  • Exposure to advanced packaging technologies and high-impact customer programmes
  • Strong career progression into senior technical or operational leadership roles
  • Collaborative, fast-paced environment with high visibility to senior stakeholders
  • Competitive compensation aligned with leadership-level technical roles



Contact
Isabelle De Costa
Quote job ref
JN-062026-7031439
Phone number
+603 2302 4075

Job summary

Function
Engineering & Manufacturing
Specialisation
Test / Application / Commissioning
What is your area of specialisation?
Industrial / Manufacturing
Location
Bayan Lepas
Contract Type
Permanent
Consultant name
Isabelle De Costa
Consultant contact
+603 2302 4075
Job Reference
JN-062026-7031439

Diversity & Inclusion at Michael Page

We don't just accept difference - we celebrate it. We encourage applicants from all backgrounds to apply for this role and are committed to building inclusive, diverse workplaces where everyone can thrive. If you require any support or reasonable adjustments during the recruitment process, please let us know.