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Advanced Packaging Process Engineer

Melaka Permanent MYR9,000 - MYR15,000 per month (MYR108,000 - MYR180,000 per year) View Job Description
Seeking a highly motivated and experienced Advanced Packaging Process Engineer to drive the development and optimization of cutting-edge packaging technologies for power module products. This role will be instrumental in ensuring our products' competitiveness through the implementation of the latest industry capabilities in a high-volume manufacturing environment.
  • Growing and Expanding organisation
  • Attractive Benefits

About Our Client

Our client is a renowned semiconductor player expanding their footprint in Malaysia.

Job Description

  • Optimizing and establishing robust, high-speed process parameters for various component attach processes, stack-up, and molding (transfer or compression) technology.
  • Defining simplified manufacturing process sequences for different component attachment methods.
  • Managing multiple new product executions from kick-off, product prototyping, characterization, learning cycles, and qualifications through to RTM, including project documentation.
  • Collaborating closely with factory operations teams to meet manufacturing indices, quality standards, and cost targets.
  • Engaging with global package platform and emerging technology teams to execute differentiated technology roadmaps and establish process capabilities proactively.
  • Driving power module package competitiveness by adopting the latest industry advancements in high-volume manufacturing.

The Successful Applicant

  • Bachelor's degree in Mechanical Engineering, Physics, Material Science, or a related field.
  • Minimum 8 years of experience in the semiconductor field.
  • Experience with SMT and leaded module technologies.
  • Broad and deep technical understanding of QFN packages integrated with wire bond interconnect, flip-chip interconnect, passive component, and inductor integration.
  • Project management experience in the semiconductor industry, specifically in Assembly Test or SMT operations.
  • Experience with assembly of power module packaging, substrate design, and reliability requirements.
  • Hands-on experience with flip-chip, chip shooter, or other component attachment equipment (for resistors, capacitors, inductors, clips).



What's on Offer

  • Great salary package and long term career development plans
  • Being part of a market leader in the semiconductor world.
Contact
Tristan Voon
Quote job ref
JN-022025-6662840
Phone number
6012 375 5546

Job summary

Function
Engineering & Manufacturing
Specialisation
Engineering Design, R&D and NPI
What is your area of specialisation?
Industrial / Manufacturing
Location
Melaka
Contract Type
Permanent
Consultant name
Tristan Voon
Consultant contact
6012 375 5546
Job Reference
JN-022025-6662840

Diversity & Inclusion at Michael Page

We don't just accept difference - we celebrate it. We encourage applicants from all backgrounds to apply for this role and are committed to building inclusive, diverse workplaces where everyone can thrive. If you require any support or reasonable adjustments during the recruitment process, please let us know.